Method for Signal Transmission between Semiconductor Substrates, and Semiconductor Component Comprising Such Semiconductor Substrates
OwnerAndre Hanke, Helmuth Hermann +1inventors
InventorsAndre Hanke, Helmuth Hermann, Michael Dunkel
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Abstract
An AC voltage signal is transmitted between a semiconductor substrate and a further semiconductor substrate arranged on the first semiconductor substrate by means of an electromagnetic field through one of the two semiconductor substrates by virtue of each semiconductor substrate having a circuit element that serves for transmission. Both circuit elements are directly electrically decoupled.
Claims44
A method for signal transmission between at least two stacked semiconductor substrates, the method comprising:
- transmitting an AC voltage signal from a first circuit element to a second circuit element, the first circuit element being arranged on a first semiconductor substrate of the at least two stacked semiconductor substrates and the second circuit element being arranged on a second semiconductor substrate of the at least two stacked semiconductor substrates;
- wherein transmitting the AC voltage signal includes transmitting the AC signal through at least one of the semiconductor substrates of the at least two stacked semiconductor substrates,
- wherein transmitting the AC voltage signal includes transmitting the AC signal utilizing electromagnetic propagation by means of an electromagnetic field and in directly electrically decoupled fashion through one of the two semiconductor substrates.
A semiconductor component comprising semiconductor substrates, comprising:
- at least two semiconductor substrates stacked one on top of another and each having a front side in which an integrated circuit is formed, and a rear side opposite the front side;
- and
- a circuit element on each of the semiconductor substrates for signal transmission from one circuit element to another by means of an electromagnetic field, wherein the two circuit elements are directly electrically decoupled.
A semiconductor component comprising:
- at least two semiconductor substrates, each semiconductor substrate having a front side in which an integrated circuit is formed, and a rear side opposite the front side, and
- a carrier substrate on which the semiconductor substrates are arranged, the carrier substrate having at least one first coil for inductive signal transmission to a lower one of the semiconductor substrates;
- wherein at least one semiconductor substrate of the semiconductor component has a second coil for inductive signal transmission, and the semiconductor substrates are arranged on the carrier substrate in such a way that the two coils are opposite one another.
A semiconductor substrate for producing a semiconductor component with inductive signal transmission, the substrate comprising
- a front side having an integrated circuit;
- a rear side opposite the front side;
- and
- a lateral coil arranged on at least one of the front side and/or the rear side.
A semiconductor component comprising:
- a first semiconductor substrate having a front side and a rear side opposite the front side, an integrated circuit being disposed at the front side of the first semiconductor substrate;
- a further substrate having a top side and an underside, the further substrate being connected to the first semiconductor substrate, wherein the first semiconductor substrate has a first electrode and the substrate has a second electrode arranged in such a way that the first and second electrodes are opposite one another with a space therebetween;
- and
- a dielectric arranged in the space between the first and second electrodes, such that the first and second electrodes together with the dielectric form an outer capacitive contact for capacitive signal transmission between the substrate and the semiconductor substrate.
A semiconductor substrate for producing a semiconductor component with capacitive signal transmission, the substrate comprising:
- a front side having an integrated circuit;
- a rear side opposite the front side;
- and
- a first electrode on the front side of the semiconductor substrate;
- and
- a second electrode on the rear side of the semiconductor substrate, wherein the electrodes are electrically connected to one another.
Dependencies are inferred from the claim text.