High Density Interconnect System Having Rapid Fabrication Cycle

An apparatus, comprising:

• a motherboard substrate having a bottom surface and a top surface, and a plurality of electrical conductors extending from the top surface to the bottom surface, said electrical conductors forming a pattern of electrical connections on the bottom surface of said motherboard substrate;
• a plurality of probe springs for providing electrical connections to at least one integrated circuit device on a semiconductor wafer, said probe springs having electrical connections to a plurality of standard connections on a probe spring mounting surface, said standard connections corresponding to said pattern of electrical connections on said bottom surface of said motherboard substrate;
• a standardized vertical translation block having a motherboard interface surface and a probe spring mounting surface comprising a plurality of electrical conductors corresponding to the pattern of electrical connections on the bottom surface of said motherboard substrate, said electrical conductors extending from said motherboard surface to said probe spring mounting surface thereby forming a standardized component for providing a plurality of electrically conductive connections between said pattern of electrical connections on the bottom surface of said motherboard substrate and said probe spring mounting surface extending over a predetermined vertical translation distance.