Rf integrated circuit test methodology and system

A method for testing a microelectronic die or package/module device under test (DUT) that has an integrated RF antenna, comprising:

• installing the DUT to a first printed wiring board so that a temporary electrical connection is made between a plurality of pins of the DUT and a first plurality of contact points of the first board, respectively;
• bringing the first board, with the installed DUT, towards a second printed wiring board until a temporary electrical connection is made between a second plurality of contact points of the first board and a plurality of contact points on the second board, respectively;
• and, while the temporary connections are there, performing a test of the DUT by
• a) sending conducted test signals to the installed DUT via the plurality of contact points of the second board and receiving associated radiated test signals radiated by the integrated RF antenna of the installed DUT, and/or
• b) radiating RF test signals to the integrated RF antenna of the installed DUT and receiving associated conducted test signals from the installed DUT via the plurality of contact points of the second board.

A method for testing a microelectronic die or package/module device under test (DUT) that has an integrated RF antenna, comprising:

• installing the DUT to a first printed wiring board so that a temporary electrical connection is made between a plurality of contact points of the first board and a plurality of pins of the DUT, respectively;
• and, while the temporary connections are there, performing a test of the DUT by
• a) sending conducted test signals to the installed DUT via the plurality of contact points of the first board and receiving associated radiated test signals through an RF radiation passage in the first board, wherein the test signals are radiated by the integrated RF antenna of the installed DUT, and/or
• b) radiating RF test signals through the RF radiation passage in the first board, to the integrated RF antenna of the installed DUT and receiving associated conducted test signals from the installed DUT via the plurality of contact points of the first board.