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US 2009/0153138 A1Published application
Sensor module and method for manufacturing a sensor module
AssigneeInfineon Technologies AG
InventorHorst Theuss
Life of this patent
Estimating the term…
Abstract
A method of manufacturing a sensor module includes providing a substrate comprising an array of magnetically sensitive elements on a first main face of the substrate. An array of conducting lines is applied over the first main face of the substrate. An array of electrical interconnects is applied over the first main face of the substrate. The substrate is singulated after application of the electrical interconnects.
Claims21
A method of manufacturing a sensor module comprising:
- providing a substrate comprising an array of magnetically sensitive elements on a first main face of the substrate;
- applying an array of conducting lines over the first main face of the substrate;
- applying an array of electrical interconnects over the first main face of the substrate;
- and
- singulating the substrate after application of the electrical interconnects.
2 more elements
A sensor module comprising:
- a substrate comprising a magnetically sensitive element;
- at least four solder elements applied to the substrate;
- and
- a conducting line connecting at least two of the at least four solder elements.
1 more element
A sensor module, comprising:
- a substrate comprising a magnetically sensitive element;
- and
- a conductor coil configured to generate a magnetic field that is adapted to be applied to the magnetically sensitive element.
A method of manufacturing a sensor module comprising:
- providing a substrate comprising an array of magnetically sensitive elements on a first main face of the substrate;
- applying an array of conducting lines over the first main face of the substrate;
- applying an array of solder elements over the first main face of the substrate;
- and
- singulating the substrate after application of the solder elements.
2 more elements
Dependencies are inferred from the claim text.