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US 2009/0153023 A1Published application
White light emitting diode and method of manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsSergiy Shylo, Dong Ik Shin
Life of this patent
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Abstract
Provided is a white LED including a reflector cup; an LED chip mounted on the bottom surface of the reflector cup; transparent resin surrounding the LED chip; a phosphor layer formed on the transparent resin; and a light transmitting layer that is inserted into the surface of the phosphor layer so as to form an embossing pattern on the surface, the light transmitting layer transmitting light, incident from the phosphor layer, in the upward direction.
Claims21
A white light emitting diode (LED) comprising:
- a reflector cup;
- an LED chip mounted on the bottom surface of the reflector cup;
- transparent resin surrounding the LED chip;
- a phosphor layer formed on the transparent resin;
- and
- a light transmitting layer that is inserted into the surface of the phosphor layer so as to form an embossing pattern on the surface, the light transmitting layer transmitting light, incident from the phosphor layer, in the upward direction.
3 more elements
A white LED comprising:
- a reflector cup that is inclined upward;
- an LED chip that is mounted on the bottom surface of the reflector cup;
- a molding compound that is filled in the reflector cup so as to surround the LED chip;
- a phosphor layer that is formed on the molding compound;
- and
- a light transmitting layer that is formed by inserting a plurality of spherical particles into the surface of the phosphor layer such that an embossing pattern is formed on the surface,
- wherein a ratio of the radius of the spherical particles to the height of the embossing pattern from the surface of the phosphor layer ranges from 0.6 to 1.
4 more elements
A method of manufacturing a white LED, comprising the steps of:
- preparing a reflector cup;
- mounting an LED chip on the bottom surface of the reflector cup;
- forming a molding compound in the reflector cup such that the LED chip is surrounded by the molding compound;
- forming a phosphor layer on the molding compound;
- and
- forming a light transmitting layer by inserting a plurality of spherical particles into the phosphor layer such that an embossing pattern is formed on the surface of the phosphor layer.
3 more elements
Dependencies are inferred from the claim text.