Light source module and method for manufacturing same
AssigneeFoxsemicon Integrated Technology, Inc.
InventorWEN-JANG JIANG
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Abstract
A light source module includes a light source and an thermoelectric cooler. The thermoelectric cooler includes a first base board, a second base board and a number of thermoelectric cooling units. The first base board includes a first surface and an opposing second surface. The second base board includes a top surface and a bottom surface. The light source is defined on the first surface of the first base board. The thermoelectric cooling units are disposed between the first surface of the first base board and the top surface of the second base board, and are configured for transferring heat generated from the light source from the first base board to the second base board.
Claims20
A light source module comprising:
- at least a light source;
- and
- a thermoelectric cooler comprising a first base board, a second base board and a plurality of thermoelectric cooling units, the first base board comprising a first surface and an opposing second surface, the second base board comprising a top surface and a bottom surface;
- wherein the light source is mounted on the first surface of the first base board, the thermoelectric cooling units are disposed between the first surface of the first base board and the top surface of the second base board, and configured for transferring heat generated by the light source from the first base board to the second base board.
A light source module comprising:
- an thermoelectric cooler comprising a circuit board, a cooling board and a plurality of thermoelectric cooling units disposed between the circuit board and the cooling board;
- and
- a plurality of light emitting diodes mounted on an opposite side of the circuit board to the thermoelectric cooling units.
A method for manufacturing a light source module comprising:
- forming a light emitting diode on a surface of a medium;
- providing a first base board comprising a first surface and an opposing second surface, and a second base board comprising a top surface and a bottom surface;
- attaching the first base board to the light emitting diode on the medium such that the light emitting diode is fixed on the first surface of the first base board;
- removing the medium from the light emitting diode;
- forming a circuit on the first surface of the first base board;
- disposing a plurality of thermoelectric cooling units between the second surface of the first base board and the top surface of the second base board;
- and
- packaging the light emitting diode.
Dependencies are inferred from the claim text.