Semiconductor device

Semi-conductor device, comprising:

• a leadframe comprising a die pad for mounting a semi-conductor die and a plurality of leads for connection with the semi-conductor die, the leads being arranged at a distance from the die pad;
• wherein the die pad has a substantially flat bottom surface and a top surface, the top surface having a die attachment portion and a downbond attachment portion for connecting downbonds;
• wherein, at least one location between the die attachment surface portion and the downbond attachment surface portion, the top surface of the die pad has at least one third surface portion that is out-of-plane with the die attachment surface portion, and at least one substantially step-shaped surface transition between the die attachment surface portion and said third surface portion;
• a semi-conductor die attached to the die attachment portion of the die pad, the semi-conductor die comprising an integrated circuit;
• a plurality of standard bonds connecting said integrated circuit to respective leads;
• a plurality of downbonds connecting said integrated circuit to the downbond attachment portion of the die pad;
• and
• a plastic package encapsulating at least the semi-conductor die, the standard bonds and the downbonds.

Method for manufacturing a semi-conductor device, the method comprising the steps of:

• providing a base leadframe strip;
• using an etching process, defining at least one leadframe, comprising a die pad and a plurality of leads, wherein the die pad has a substantially flat bottom surface and a top surface, the top surface having a die attachment portion and a downbond attachment portion for connecting downbonds;
• using an etching process, etching away at least a portion of the top surface of the die pad, at least one location between the die attachment surface portion and the downbond attachment surface portion, to define at least one third surface portion that is out-of-plane with the die attachment surface portion, and at least one substantially step-shaped surface transition between the die attachment surface portion and said third surface portion;
• attaching a semi-conductor die to the die attachment portion of the die pad, the semi-conductor die comprising an integrated circuit;
• connecting standard bonds to said integrated circuit and to respective leads;
• connecting downbonds to said integrated circuit and to the downbond attachment portion of the die pad;
• applying molten plastic material on the top surface of the die pad, for encapsulating at least the semi-conductor die, the standard bonds and the downbonds.