Electronic device

A semiconductor assembly comprising:

• a printed circuit board;
• and
• a semiconductor package electrically coupled to the printed circuit board, the semiconductor package comprising:
• a leadframe comprising a die pad, tiebars extending from the die pad, and multiple leads configured to electrically communicate with the die pad,
• a chip attached to the die pad,
• a first structure element separate from the leadframe and coupled to the tiebars, the first structure element separated from each of the multiple leads;
• a first connector electrically coupling the chip and the first structure element,
• a second connector electrically coupling the first structure element to one of the multiple leads.

A method of fabricating a semiconductor package comprising:

• providing a leadframe strip comprising at least one leadframe, each leadframe including an island and multiple leads;
• attaching a structure element to the at least one leadframe;
• attaching a chip to the island of the at least one leadframe;
• electrically connecting the chip to the structure element;
• and
• electrically connecting the structure element to one of the multiple leads.

A semiconductor device comprising:

• a leadframe comprising a die pad, a pair of spaced tiebars extending from the die pad, and multiple leads configured to electrically communicate with a chip coupled to the die pad;
• a first bus coupled between the spaced tiebars;
• at least one additional bus coupled between the spaced tiebars;
• wherein the first bus is coupled to a first set of the multiple leads to define one of a ground bus and a power bus and the at least one additional bus is coupled to a second set of the multiple leads to define one of a ground bus and a power bus.