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US 2009/0152693 A1Published application
Semiconductor device
AssigneeShinko Electric Industries Co., Ltd.
InventorHitoshi Sato
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes a wiring board having: plural stacked insulating layers; test pads and external connection pads which are disposed on a face of the plural stacked insulating layers located on the side opposite to that where another wiring board is connected; first wiring patterns which electrically connect internal connection pads with the test pads; and second wiring patterns which electrically connect semiconductor element mounting pads with the external connection pads. The external connection pads are placed on the inner side of the test pads.
Claims8
A semiconductor device comprising:
- a first wiring board having
- plural stacked insulating layers,
- an internal connection pad which is disposed on a side of an upper face of the plural stacked insulating layers,
- a semiconductor element mounting pad which is disposed on the side of the upper face of the plural stacked insulating layers,
- a test pad which is disposed on a side of a lower face of the plural stacked insulating layers, and
- an external connection pad which is disposed on the side of the lower face of the plural stacked insulating layers, and on which an external connecting terminal is disposed,
- a first wiring pattern which is disposed in the plural stacked insulating layers, and which electrically connects the internal connection pad with the test pad, and
- a second wiring pattern which electrically connects the semiconductor element mounting pad with the external connection pad;
- a second wiring board which is placed above the first wiring board, which is mounted on the internal connection pad, and which is electrically connected with the first wiring board;
- and
- a semiconductor element which is mounted on the semiconductor element mounting pad,
- wherein the external connection pad is placed on an inner side of the test pad.
9 more elements
Dependencies are inferred from the claim text.