Integrated Circuit Package for High-Speed Signals

An integrated circuit package comprising:

• a chip having a circuit thereon;
• a multi-segment transmission line transformer having a first port and a second port, the first port coupled the circuit;
• and
• a via stack adapted to electrically couple the second port to a printed circuit board;
• wherein the transmission line transformer comprises:
• a middle segment;
• a first end segment coupled between the first transformer port and the middle segment;
• and
• a second end segment coupled between the second transformer port and the middle segment;
• wherein between the first transformer port and the circuit is a first propagation delay, wherein the via stack has a second propagation delay, and wherein the first end segment has a propagation delay approximately equal to the first propagation delay, and the second end segment has a propagation delay approximately equal to the second propagation delay.

An integrated circuit package comprising:

• a chip having a circuit thereon;
• a multi-segment transmission line transformer having a first port and a second port, the first port coupled the circuit;
• and
• a via stack adapted to electrically couple the second port to a printed circuit board;
• wherein the transmission line transformer comprises one or more segment pairs, each segment pair comprising:
• a first segment coupled to the first transformer port;
• and
• a second segment coupled between the first segment and the second transformer port;
• wherein between the first transformer port and the circuit is a first propagation delay,
• wherein the via stack has a second propagation delay, and wherein the first segment has a propagation delay approximately equal to the first propagation delay, and the second segment has a propagation delay approximately equal to the second propagation delay.