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US 2009/0152688 A1Published application
Integrated circuit package system for shielding electromagnetic interference
AssigneeSTATS ChipPAC, Ltd.
InventorsByung Tai Do, Heap Hoe Kuan, Rui Huang
Life of this patent
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Abstract
An integrated circuit package system comprising: providing a substrate; coupling an integrated circuit to the substrate; mounting a shielding element around the integrated circuit; applying a conductive shielding layer on the shielding element; and coupling a system interconnect to the shielding element.
Claims20
An integrated circuit package system comprising:
- providing a substrate;
- coupling an integrated circuit to the substrate;
- mounting a shielding element around the integrated circuit;
- applying a conductive shielding layer on the shielding element;
- and
- coupling a system interconnect to the shielding element.
3 more elements
An integrated circuit package system comprising:
- providing a substrate including providing a strip substrate or a system in package substrate;
- coupling an integrated circuit to the substrate including coupling a wire bond integrated circuit, a flip chip integrated circuit, or a combination thereof,
- mounting a shielding element around the integrated circuit including adhering the shielding element to the substrate;
- applying a conductive shielding layer on the shielding element including applying the conductive shielding layer over the integrated circuit;
- and
- coupling a system interconnect to the shielding element including coupling the conductive shielding layer.
3 more elements
An integrated circuit package system comprising:
- a substrate;
- an integrated circuit coupled to the substrate;
- a shielding element around the integrated circuit;
- a conductive shielding layer on the shielding element;
- and
- a system interconnect coupled to the shielding element.
3 more elements
Dependencies are inferred from the claim text.