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US 2009/0152687 A1Published application
Method of opening pad in semiconductor device
AssigneeDongbu HiTek Co., Ltd.
InventorDae-Heok Kwon
Life of this patent
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Abstract
A method of opening a pad in a semiconductor device. A protective film on a pad may be etched with a pad opening pattern as a mask. Dielectric heating may be performed on the pad opened by etching the protective film. Organic material containing C and F groups on the pad may be removed by heating with molecular vibration and/or microwaves, which may substantially prevent and/or minimize corrosion.
Claims20
A method comprising:
- forming a protective film over a pad;
- opening the pad by etching the protective film using a pad opening pattern as a mask;
- and
- dielectric heating the opened pad.
1 more element
An apparatus comprising a protective film formed over a pad, wherein the pad is opened by etching the protective film using a pad opening pattern as a mask and dielectric heating the opened pad.
Dependencies are inferred from the claim text.