Semiconductor Devices and Methods of Manufacture Thereof
AssigneeInfineon Technologies AG
InventorJosef Maynollo
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Abstract
Methods of fabricating semiconductor devices and structures thereof are disclosed. In a preferred embodiment, a method of fabricating a semiconductor device includes providing a workpiece having a plurality of trenches formed therein, forming a liner over the workpiece, and forming a layer of photosensitive material over the liner. The layer of photosensitive material is removed from over the workpiece except from over at least a portion of each of the plurality of trenches. The layer of photosensitive material is partially removed from over the workpiece, leaving a portion of the layer of photosensitive material remaining within a lower portion of the plurality of trenches over the liner.
Claims5
A semiconductor device, comprising:
- a workpiece, the workpiece including a first region, a second region, and a top surface;
- a plurality of trenches disposed in the second region but not the first region of the workpiece, each of the plurality of trenches comprising sidewalls, a bottom surface, and a lower portion;
- and
- a liner disposed over the sidewalls and the bottom surface of the lower portion of each of the plurality of trenches, wherein the liner comprises substantially the same dimension beneath the top surface of the workpiece within each of the plurality of trenches, or wherein the liner comprises a first dimension on a first sidewall of each of the plurality of trenches and a second dimension on a second sidewall opposing the first sidewall of each of the plurality of trenches.
Dependencies are inferred from the claim text.