Reflowable camera module with improved reliability of solder connections

A reflowable camera module, comprising:

• a Chip Scale Package (CSP) carrier, the carrier defining a rectangular surface area having a first side, a second side, and four corners;
• an image sensor mounted to the first side of the CSP carrier;
• an optical capping layer having at least one optical lens element covering the image sensor;
• solder contact regions formed in a central portion of the second side of the carrier dedicated to provide electrical signal and power connections between the image sensor and a printed circuit substrate after a reflow process;
• and
• each of the four corners of the second side of the CSP carrier having a corner region including at least one dummy solder contact region to provide mechanical support to the solder contact regions dedicated to provide electrical signal and power connections, the at least one dummy solder contact region not providing electrical signal or power connections to the image sensor.

A reflowable camera module, comprising:

• a Chip Scale Package (CSP) carrier, the carrier defining a rectangular surface area having a first side, a second side, and four corners;
• an image sensor mounted to the first side of the CSP carrier;
• an optical capping layer having at least one optical lens element covering the image sensor;
• solder contact regions formed in a central portion of the second side of the carrier dedicated to provide electrical signal and power connections between the image sensor and a printed circuit substrate after a reflow process;
• and
• at least one lead extending over an outer surface of the camera module and having two lead ends extending out from the camera module to permit the lead ends to be attached to a printed circuit substrate to provide additional lateral mechanical support to protect solder joints between the printed circuit substrate and the camera module.