Surface mount multi-axis electronics package for micro-electrical mechanical systems(MEMS) devices
OwnerHamid R. Borzabadi, Ronald D. Wilcoxinventors
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Abstract
A surface mount multi-axis cavity package for micro-electrical mechanical systems (MEMS) devices includes a substantially cubical housing having a plurality of sides and at least one internal cavity. A first plurality of solder pads are positioned on at least one side of the housing and a second plurality of solder pads are positioned on a bottom of the housing. A MEMS sensor is then mounted within the at least one internal cavity in any axis for increasing the versatility of the MEMS device.
Claims22
A surface mount multi-axis cavity package for micro-electrical mechanical systems (MEMS) devices comprising:
- a substantially cubical housing having at least one internal cavity;
- a first plurality of solder pads positioned on at least one side of the housing;
- a second plurality of solder pads positioned on a bottom of the housing;
- and
- wherein a MEMS sensor is mounted within the at least one internal cavity.
A multi-axis packaging device for use with a MEMS sensor for mounting to a printed circuit board (PCB) comprising:
- a substantially cubical housing having a lid for accessing an internal cavity;
- a first set of solder pad connections located on at least one side of the substantially cubical housing for connection to the PCB;
- a second set of solder pad connections located on a bottom of the substantially cubical housing for connection to a PCB;
- and
- at least one lead frame positioned within a wall of the substantially cubical housing for interconnecting the first set of solder pad connections and the second set of solder pad connections to the MEMS sensor.
A method for packaging a micro-electrical mechanical systems (MEMS) device in a multi-axis cavity package comprising the steps of:
- providing a substantially cubical housing having at least one internal cavity;
- positioning a first plurality of solder pads on at least one side of the housing;
- positioning a second plurality of solder pads on a bottom of the housing;
- and
- mounting a MEMS sensor within the at least one internal cavity.
Dependencies are inferred from the claim text.