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AssigneeNippon Carbide Industries Co., Inc.
InventorsKeiichi Kishimoto, Makoto Ida, Yoshiaki Teraishi
Estimating the term…
[Problems] To provide a package for light emitting element accommodation that realizes enhanced reflectance without application of a metal plating onto a ceramic. [Means for Solving Problems] There is provided a package for light emitting element accommodation comprising ceramic substrate (2) having conductor mounting region (8) for mounting of light emitting element (1) on its upper surface; frame (4) of a light reflecting material containing 74.6 mass % or more of alumina whose average particle diameter after sintering is 2.5 μm or less, the frame (4) disposed on an upper surface of the substrate (2) in such a fashion that internal circumferential surface (7) of through-hole (3) expands outward; and light emitting element (1) mounted on the conductor mounting region (8) of the substrate (2). Thus, the reflectance of the frame (4) is enhanced without application of a metal plating thereonto.
A light reflecting material containing alumina whose particle diameter after sintering is not more that 25 μm at not less than 74.6 mass %.
A package for a light emitting element accommodation comprising:
A light emitting device comprising:
A method of manufacturing a package for a light emitting element wherein the package comprises a substrate comprising of ceramic and a frame body formed on an upper surface of the substrate, comprising:
Dependencies are inferred from the claim text.