Semiconductor Component
AssigneeMicronas GmbH
InventorsStefan Kredler, Reiner Bidenbach, Jens Schubert, Klaus Heberle
Life of this patent
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Abstract
A semiconductor component (has at least one semiconductor chip in which an electrical circuit is integrated. The semiconductor chip is surrounded by an electrically insulating encapsulating compound and has on its surface at least one termination surface for a test signal, which is covered by the encapsulating compound. The termination surface is connected in an electrically conductive manner to an analysis contact that projects above the surface of the semiconductor chip, that is located in the interior of the encapsulating compound at a distance from its exterior surface, and that can be exposed by removing a layer of the encapsulating compound located near the exterior.
Claims7
A semiconductor component having at least one semiconductor chip in which an electrical circuit is integrated, wherein the semiconductor chip has at least one termination surface for a test signal, and wherein the semiconductor chip is surrounded by an electrically insulating encapsulating compound that covers the termination surface, wherein the termination surface is connected in an electrically conductive manner with an analysis contact that projects above the surface of the semiconductor chip, that is located in the interior of the encapsulating compound at a distance from the exterior surface, and that can be exposed by removing areas of the encapsulating compound.
Dependencies are inferred from the claim text.