Integrated circuit packaging system with leadframe interposer and method of manufacture thereof

A method of manufacture of an integrated circuit packaging system comprising:

• forming a substrate including forming a contact via in the substrate;
• mounting a base integrated circuit on the substrate including applying an adhesive between the base integrated circuit and the substrate;
• forming a leadframe interposer, over the base integrated circuit, by:
• embossing a metal sheet including forming an array by pressing, etching, laser trimming, or a combination thereof,
• mounting an integrated circuit die on the metal sheet including coupling a test pad to the integrated circuit die,
• injecting a molded package body on the integrated circuit die and the metal sheet including injecting an epoxy molding compound, and
• etching a ball pad, a bond finger, or a combination thereof from the metal sheet that is not protected by the molded package body including forming a one-on-one connection between the ball pad and the bond finger;
• coupling a circuit package on the ball pad including coupling an integrated circuit, discrete components, or a combination thereof;
• and
• forming a component package on the substrate, the base integrated circuit, and the leadframe interposer.

An integrated circuit packaging system comprising:

• a substrate;
• a base integrated circuit mounted on the substrate;
• a leadframe interposer, over the base integrated circuit, includes:
• ball pads, bond fingers, or a combination thereof,
• an integrated circuit die mounted over the ball pads, and
• a molded package body on the integrated circuit die, the ball pads, and the bond fingers;
• a circuit package coupled on the ball pads;
• and
• a component package on the substrate, the base integrated circuit, and the leadframe interposer.