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US 2009/0152540 A1Published application
Semiconductor device and process for producing same
AssigneeSony Corporation
InventorKazumasa Nomoto
Life of this patent
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Abstract
A semiconductor device and process for producing same are provided. The process for producing a semiconductor device includes a first embossing step of pressing a stamp having a relief pattern onto a surface of a substrate to form a depression pattern on the surface of the substrate; a second step of feeding an application material composed of a semiconductor material or a conductive material into the depression pattern by printing; and a third step of curing the application material fed by printing.
Claims1
A semiconductor device comprising:
- a substrate;
- a semiconductor material layer or a conductive material layer produced by solidifying an application material;
- and
- a depression pattern disposed at a surface of the substrate, wherein the depression pattern is selectively filled with the semiconductor material layer or the conductive material layer.
1 more element
Dependencies are inferred from the claim text.