Latent Curing Agent
AssigneeSony Chemical & Information Device Corporation
InventorsKatsuhiko Komuro, Masahiko Ito, Daisuke Masuko
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Abstract
An aluminum chelate-based latent curing agent is provided which can cure a thermosetting epoxy resin at a relatively low temperature in a short period of time. A method for producing such an aluminum chelate-based latent curing agent, whose curing conditions can be relatively easily controlled, is also provided. The aluminum chelate-based latent curing agent is made latent by reacting a silsesquioxane-type oxetane derivative with an aluminum chelating agent in the presence of an alicyclic epoxy compound.
Claims24
An aluminum chelate-based latent curing agent being made latent by reacting a silsesquioxane-type oxetane derivative with an aluminum chelating agent in the presence of an alicyclic epoxy compound.
A method for producing an aluminum chelate-based latent curing agent, the method comprising:
- reacting an aluminum chelating agent and a silsesquioxane-type oxetane derivative in the presence of an alicyclic epoxy compound in a non-aqueous solvent by heating;
- and again adding an alicyclic epoxy compound to the reaction mixture and reacting it by heating to obtain the aluminum chelate-based latent curing agent as a sediment.
Dependencies are inferred from the claim text.