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US 2009/0152491 A1Published application
Thermally conductive resin compositions
AssigneeE. I. Du Pont de Nemours and Company
InventorYuji Saga
Life of this patent
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Abstract
Thermally conductive polymer resin compositions comprising polymer, spherical or granular shape thermally conductive filler, and platy thermally conductive filler, and optionally a polymeric toughening agent. The compositions are particularly useful for metal/polymer hybrid parts.
Claims23
A thermally conductive polymer composition, comprising:
- (a) about 25 to about 75 volume percent of polymer;
- (b) about 7 to about 65 volume percent of electrically insulative and spherical or granular shaped thermally conductive filler;
- (c) about 2 to about 50 volume percent of electrically insulative platy thermally conductive fillers;
- and wherein the volume ratio of (c) to (b) is between 10 to 90 and 70 to 30.
- the above stated percentages being based on the total volume of the composition.
2 more elements
Dependencies are inferred from the claim text.