Hole Inspection Apparatus and Hole Inspection Method using the Same
AssigneeCEBT Co., Ltd.
InventorHo Seob Kim
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Abstract
Disclosed herein is an apparatus and method for inspecting the via holes of a semiconductor device using electron beams. The apparatus includes electron beam irradiation means, a current measuring means, and a current measuring means and data processing means. The electron beam irradiation means radiate respective electron beams to inspect a plurality of inspection target holes. The current measuring means measures current, which is generated by irradiating the electron beams, radiated from the electron beam irradiation means, through a conductive layer located under the holes, or through the conductive layer and a separate detector. The data processing means processes data acquired through the measurement of the current measuring means.
Claims22
A hole inspection apparatus, comprising:
- electron beam irradiation means for irradiating respective electron beams to inspect a plurality of inspection target holes;
- current measuring means for measuring current, which is generated by irradiating the electron beams radiated from the electron beam irradiation means, through a conductive layer located under the holes, or through the conductive layer and a separate detector;
- and
- data processing means for processing data acquired through the measurement of the current measuring means;
- wherein a plurality of electron columns, which are used as the electron beam irradiation means, are disposed in an n×m arrangement in such a way that each electron column corresponds to a plurality of holes, and is simultaneously or sequentially operated,
- the current measuring means measures current values for the respective holes in response to the simultaneous or sequential operation of the electron columns, and
- the data processing means sequentially or simultaneously processes the data measured by the current measuring means,
- whereby information about whether the holes are open at both ends thereof is acquired.
A hole inspection method, comprising the steps of:
- disposing a plurality of electron columns, which are used as the electron beam irradiation means, in an n×m arrangement in such a way that each electron column corresponds to a plurality of holes, and irradiating a plurality of electron beams;
- measuring current, which is generated by the electron beams irradiated by the electron columns, using a conductive layer formed under the holes, or using the conductive layer and a detector;
- and
- processing the measured current data;
- whereby information about pass-through of each hole is acquired.
Dependencies are inferred from the claim text.