Method and apparatus for mounting at least two types of electronic components
AssigneeSamsung Techwin Co., Ltd.
InventorsKyeong-heon Kim, Tae-hun Kim, Dong-hee Kim
Life of this patent
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Abstract
Provided is a method and apparatus for mounting a plurality of electronic components. The method comprises mounting a first electronic component on a substrate; forming a mask on the substrate to expose the first electronic component and a region of the substrate on which a solder paste is to be applied; forming a guide on a portion of the mask disposed around the first electronic component; applying the solder paste onto the substrate by using a squeezer contacting a portion of the mask disposed around the region of the substrate on which the solder paste is to be applied; removing the guide and the mask; and mounting a second electronic component on the solder paste.
Claims15
A method of mounting at least two types of electronic components, the method comprising:
- mounting a first electronic component on a substrate;
- forming a mask on the substrate to expose the first electronic component and a region of the substrate on which a solder paste is to be applied;
- forming a guide on a portion of the mask disposed around the first electronic component;
- applying the solder paste onto the substrate by using a squeezer contacting a portion of the mask disposed around the region of the substrate on which the solder paste is to be applied;
- removing the guide and the mask;
- and
- mounting a second electronic component on the solder paste.
A method of mounting at least two kinds of electronic components, the method comprising:
- forming a first mask on a substrate to expose a region of the substrate on which a first solder paste is to be applied;
- applying the first solder paste onto the substrate by using a first squeezer;
- removing the first mask;
- mounting a first electronic component on the first solder paste;
- forming a second mask on the substrate on which the first electronic component is mounted to expose the first electronic component and a region of the substrate on which a second solder paste is to be applied;
- forming a guide on a portion of the second mask disposed around the first electronic component;
- applying the second solder paste onto the substrate by using a second squeezer having at least one concave portion that accommodates the first electronic component and the guide;
- removing the second mask and the guide;
- and
- mounting a second electronic component on the second solder paste.
An apparatus for mounting at least two types of electronic components, the apparatus comprising:
- a substrate on which a first electronic component is mounted;
- a mask formed on the substrate to expose the first electronic component and a region of the substrate on which a solder paste is to be applied;
- a guide formed on a portion of the mask disposed around the first electronic component;
- and
- a squeezer contacting a portion of the mask disposed around the region of the substrate on which the solder paste is to be applied.
Dependencies are inferred from the claim text.