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US 2009/0152327 A1Published application
Wire bonding method
AssigneeFujitsu Limited
InventorTakayoshi MATSUMURA
Life of this patent
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Abstract
According to an aspect of an embodiment, a wire bonding method includes vibrating a capillary of a bonding head, the capillary having a heater attached thereto at a position corresponding to a node of vibration of the capillary generated by the vibration heating the capillary with the heater and performing a wire bonding operation while heating the capillary with the heater.
Claims12
A wire bonding method, comprising:
- vibrating a capillary of a bonding head, the capillary having a heater attached thereto at a position corresponding to a node of vibration of the capillary generated by the vibration;
- heating the capillary with the heater;
- and
- performing a wire bonding operation while heating the capillary with the heater.
1 more element
A wire bonding apparatus comprising:
- an ultrasonic generator to generate ultrasonic vibration;
- a transducer to transmit the ultrasonic vibration;
- a capillary attached to the transducer to receive the ultrasonic vibration and to vibrate accordingly;
- and
- at least one heater attached to the capillary at a position corresponding to a node of the vibration of the capillary.
2 more elements
A capillary mounted on a transducer for wire bonding, the transducer being configured to transmit ultrasonic vibration, the capillary comprising:
- at least one heater disposed at a position corresponding to a node of vibration of the capillary generated by the ultrasonic vibration.
Dependencies are inferred from the claim text.