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OwnerHidehiko Mishima, Yasuhito Masuda +5inventors
InventorsHidehiko Mishima, Yasuhito Masuda, Yasuhiro Okuda, Kenichi Watatani, Shuji Sakabe, Masaki Hashida, Seiji Shimizu
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In order to easily control the laser pulse width and perform high-precision processing, the method for processing a material by laser ablation according to the present invention is characterized in that the material having a region of which a double logarithmic chart shows a linearly-shaped line with a gradient of not more than 0.5, when a relationship between laser pulse width and ablation threshold is represented in the logarithmic chart with a laser pulse width in picosecond plotted along the horizontal axis and an ablation threshold in J/cm2 plotted along the vertical axis, is processed by the pulsed laser beam having the laser pulse width within the region.
A method for processing a material by laser ablation using a pulsed laser beam, wherein the material having a region of which a double logarithmic chart shows a linearly-shaped line with a gradient of not more than 0.5, when a relationship between a laser pulse width and an ablation threshold is represented in said double logarithmic chart with a laser pulse width in picosecond plotted along the horizontal axis and an ablation threshold in J/cm2 plotted along the vertical axis, is processed by the pulsed laser beam having the laser pulse width within said region.
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