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US 2009/0152239 A1Published application
Process for producing a chip using a mold
AssigneeCanon Kabushiki Kaisha
InventorsAtsunori TERASAKI, Junichi SEKI, Nobuhito SUEHIRA, Hideki INA, Shingo OKUSHIMA
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Abstract
A mold capable of a highly accurate alignment with a member to be processed in such a state that a photocurable resin material is disposed between the mold and the member to be processed, and is constituted by a substrate 2010 formed of a first material and an alignment mark 2102 formed of a second material different from the first material. The first material and the second material have transmissivities to light in a part of an ultraviolet wavelength range. The second material has a refractive index of not less than 1.7.
Claims5
A process for producing a chip, the process comprising:
- preparing a mold and a member to be processed, on which a photocurable resin material is disposed;
- forming a pattern on the photocurable resin material with the mold;
- and
- etching an area contacting a layer, in which the pattern is formed, by using the pattern as a mask,
- wherein the mold comprises:
- a substrate comprising a first material;
- and
- an alignment mark, disposed on the substrate, comprising a second material different from the first material,
- wherein the first material and the second material transmit at least light in a part of wavelength range of ultraviolet light, and
- wherein the second material has a refractive index of not less than 1.7.
7 more elements
A process for producing a chip, the process comprising:
- preparing a mold and a member to be processed, on which a photocurable resin material is disposed;
- forming a pattern on the photocurable resin material with the mold;
- and
- etching an area contacting a layer, in which the pattern is formed, by using the pattern as a mask,
- wherein the mold comprises:
- a substrate comprising a first material;
- and
- an alignment mark, disposed on the substrate, comprising a second material different from the first material,
- wherein the first material and the second material are transparent to visible light and also to light in a part of a wavelength range of ultraviolet light, and
- wherein the second material has a refractive index, with respect to visible light having a wavelength of 633 nm, of not less than 1.7.
7 more elements
A process for producing a chip, the process comprising:
- preparing a mold and a member to be processed, on which a photocurable resin material is disposed;
- forming a pattern on the photocurable resin material with the mold;
- and
- etching an area contacting a layer, in which the pattern is formed, by using the pattern as a mask,
- wherein the mold comprises:
- a substrate comprising a first material;
- a plurality of projections comprising a first layer comprising a second material different from the first material;
- and
- a second layer, comprising the second material, disposed between the projections,
- wherein the first material and the second material are transparent to visible light and also to light in a part of a wavelength range of ultraviolet light,
- wherein the second material has a refractive index, with respect to visible light having a wavelength of 633 nm, of not less than 1.7, and
- wherein the first layer and the second layer have different thicknesses.
9 more elements
A process for producing a chip, the process comprising:
- preparing a mold and a member to be processed, on which a photocurable resin material is disposed;
- forming a pattern on the photocurable resin material with the mold;
- and
- etching an area contacting a layer, in which the pattern is formed, by using the pattern as a mask,
- wherein the mold comprises:
- a substrate comprising a first material;
- and
- a plurality of projections, which are disposed on the substrate, and comprise a first layer comprising a second material,
- wherein the first material and the second material are transparent to visible light and also to light in a part of a wavelength range of ultraviolet light,
- wherein the second material has a refractive index, with respect to visible light having a wavelength of 633 nm, of not less than 1.7, and
- wherein the second material is not disposed between the projections on the substrate.
8 more elements
A process for producing a chip, the process comprising:
- preparing a mold and a member to be processed, on which a photocurable resin material is disposed;
- forming a pattern on the photocurable resin material with the mold;
- and
- etching an area contacting a layer, in which the pattern is formed, by using the pattern as a mask,
- wherein the mold comprises:
- an alignment mark area;
- and
- an imprint pattern area,
- wherein in the alignment mark area, a material having refractive index, with respect to visible light having a wavelength of 633 nm, of not less than 1.7 is disposed, and
- wherein the material in the alignment mark area is transparent to visible light and also to light in a part of a wavelength range of ultraviolet light.
7 more elements
Dependencies are inferred from the claim text.