Ceramic-Copper Foil Bonding Method
AssigneeHigh Conduction Scientific Co., Ltd.
InventorsWen-Chung Chiang, Keng-Chung Wu, Jun-Jae Wu
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Abstract
A ceramic-copper foil bonding method includes wet-oxidizing a copper foil such that a surface of the copper foil is oxidized to a copper oxide layer, contacting the copper oxide layer with a surface of a ceramic substrate, and bonding the copper oxide layer of the copper foil to the surface of the ceramic substrate by heat treatment. Preferably, a protective layer is provided on an opposite surface of the copper foil so that the opposite surface is not oxidized during wet-oxidizing the copper foil.
Claims16
A ceramic-copper foil bonding method comprising:
- wet-oxidizing a first copper foil such that a first surface of the first copper foil is oxidized to a copper oxide layer;
- contacting the copper oxide layer with a first surface of a ceramic substrate;
- and
- bonding the copper oxide layer of the first copper foil to the first surface of the ceramic substrate by heat treatment.
A ceramic-copper foil bonding method comprising:
- providing first and second copper foils, each of which has a first surface and a second surface that is opposite to the first surface;
- wet-oxidizing the first and second copper foils such that the first surface of each of the first and second copper foils is oxidized to a copper oxide layer, and the second surface of each of the first and second copper foils is not oxidized;
- contacting the copper oxide layers of the first and second copper foils with opposite first and second surfaces of a ceramic substrate, respectively;
- and
- heating the first copper foil, the second copper foil, and the ceramic substrate together, thereby bonding the same together.
Dependencies are inferred from the claim text.