Method for manufacturing liquid ejecting head and liquid ejecting apparatus
AssigneeSeiko Epson Corporation
InventorHiroki Ikeda
Life of this patent
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Abstract
A method for manufacturing a liquid ejecting head includes performing a dry cleaning process of cleaning the surface of a wire side of a second substrate by dry etching of a plasma etching mode, and performing a liquid cleaning process of cleaning the surface of a pressure generation chamber side of a first substrate.
Claims6
A method for manufacturing a liquid ejecting head including at least a first substrate in which pressure generation chambers communicating with nozzle openings are provided, pressure generation units provided at one surface side of the first substrate so as to cause a pressure variation in the pressure generation chambers, and a second substrate bonded to the surface of the first substrate, in which the pressure generation units are provided, and having a wire formed on the surface thereof, the method comprising:
- performing a dry cleaning process of cleaning the surface of the wire side of the second substrate by dry etching of a plasma etching mode;
- and
- performing a liquid cleaning process of cleaning the surface of the pressure generation chamber side of the first substrate.
Dependencies are inferred from the claim text.