Printed circuit board having chip package mounted thereon and method of fabricating same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsSuk Hyeon CHO, Chang Sup RYU, Jin Soo JEONG, Jin Yong AHN
Life of this patent
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Abstract
Disclosed is a printed circuit board (PCB) and a method of fabricating the same. A contact portion is formed on an internal layer of the multi-layered PCB. A groove is formed so as to expose the contact portion of the internal layer. A chip package is mounted on the PCB while being flip-chip bonded to the exposed contact portion of the internal layer.
Claims9
A method of fabricating a printed circuit board having a chip package mounted thereon, comprising the steps of:
- laminating an insulating layer and a first circuit layer wherein a first circuit pattern is formed on an upper side of a second circuit layer on one side of a substrate;
- removing portions of the insulating layer and the first circuit layer laminated on the substrate having a position corresponding to an area in which the chip package is mounted;
- applying a photosensitive substance on internal and external layers so that the photosensitive substance adheres closely to the internal and external layers, and forming a second circuit pattern on the photosensitive substance to form an electric contact portion and to form a third circuit pattern on the external layer;
- conducting an etching process using the second circuit pattern to form the third circuit pattern on the external layer and to form the electric contact portion on the internal layer;
- and
- mounting the chip package wherein the chip package is connected to the electric contact portion formed on the exposed second circuit layer of the substrate.
A method of fabricating a printed circuit board having a chip package mounted thereon, comprising the steps of:
- forming a first circuit pattern, on a first circuit layer of a substrate having an electric contact portion to be connected to the chip package;
- laminating an insulating layer and a second circuit layer on an upper side of the first circuit layer on one side of the substrate wherein the first circuit pattern is formed;
- removing portions of the insulating layer and the second circuit layer, laminated on the substrate, having a position corresponding to an area wherein the chip package is to be mounted;
- and
- mounting the chip package wherein the chip package is connected to the electric contact portion formed on the exposed first circuit layer of the substrate.
A method of fabricating a printed circuit board having a chip package mounted thereon, comprising the steps of:
- forming a first circuit pattern on a first circuit layer of a substrate having an electric contact portion connected to the chip package;
- surrounding the electric contact portion with an etching resistor;
- laminating an insulating layer and forming a hole wherein the chip package connected to the electric contact portion is mounted, and laminating a second circuit layer on the insulating layer;
- laminating a photosensitive substance on the second circuit layer, forming a second circuit pattern on the photosensitive substance wherein a portion, having a position corresponding to the hole, is removed, and etching the resulting substrate to form a third circuit pattern on the second circuit layer;
- and
- mounting the chip package wherein the chip package is connected to the electric contact portion formed on the exposed first circuit layer of the substrate.
Dependencies are inferred from the claim text.