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US 2009/0152153 A1Published application
Bound Envelopes
OwnerJames Bettingerinventor
Life of this patent
Estimating the term…
Abstract
An envelope package is provided, comprising an upper cover, a lower cover, a plurality of envelopes disposed between the upper cover and the lower cover, and a spiral binding disposed along the spine of the envelope package that joins the upper cover, lower cover, and the plurality of envelopes.
Claims20
An envelope package, comprising:
- an upper cover;
- a lower cover;
- a plurality of envelopes disposed between said upper cover and said lower cover;
- and
- a binding disposed along a spine of the envelope package.
2 more elements
An envelope packaging comprising:
- an upper cover having a series of punched holes at one edge;
- a lower cover having a series of punched holes at one edge;
- a plurality of envelopes disposed between said upper cover and said lower cover, each envelope comprising a closure flap having a series of punched holes at one end of the closure flap away from and parallel to a horizontal fold line of the closure flap;
- and
- a spiral binding wound through said holes in said upper cover, said lower cover and said closure flaps to provide a flexible hinge at a spine of the envelope package;
- wherein said closure flap further comprises a perforated line disposed between and parallel to said punched holes;
- and
- wherein said upper cover comprises adhesive labels attached to the upper cover by a releasable adhesive.
5 more elements
A method for manufacturing an envelope package, comprising steps of:
- providing a plurality of envelopes, each envelope having a closure flap;
- placing said plurality of envelopes between an upper cover and a lower cover;
- and
- securing said plurality of envelopes in the envelope package with the envelopes in an open state by binding said plurality of envelopes with said lower cover and said upper cover along a spine of the envelope package.
1 more element
Dependencies are inferred from the claim text.