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US 2009/0152003 A1Published application
Housing for Accommodating an Electronic Component and Electronic Component Arrangement
AssigneeEpcos AG
InventorsGuenter Feist, Juergen Frey, Herbert Baschke
Life of this patent
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Abstract
A housing can accommodate an electronic component. An outer wall of the housing forms a flat contact wall in which contact areas for connecting the housing to an interconnect device are arranged.
Claims20
A housing for accommodating an electronic component, the housing comprising:
- a plurality of housing parts that are mechanically coupled to one another;
- an outer wall of at least one of the housing parts that forms a flat contact wall;
- and
- contact areas for connecting the housing to an interconnect device, the contact areas being arranged at the contact wall.
1 more element
An electronic device comprising:
- a housing formed from a plurality of housing parts that are mechanically coupled together, an outer wall of the housing forming a contact wall with contact areas;
- and
- an electronic component disposed within a recess of the housing, the electronic component being electrically coupled to the contact areas.
An electronic device comprising:
- a housing comprising a cavity formed from a first wall, a second wall, a third wall, and a fourth wall that surround sides of the cavity and a fifth wall that encloses a bottom of the cavity;
- the housing formed from a plurality of housing parts, first ones of the housing parts comprising conductive housing parts and second ones of the housing parts comprising non-conductive housing parts;
- the first wall comprising a plurality of contact areas, each contact area being formed from a conductive housing part;
- and
- a plurality of coupling regions formed within the second and/or third walls, each coupling region being electrically coupled to a respective contact area via at least one conductive housing part.
2 more elements
Dependencies are inferred from the claim text.