Product having through-hole and laser processing method
AssigneeSumitomo Electric Industries, Ltd.
InventorsHidehiko Mishima, Yasuhiro Okuda, Shuji Sakabe, Masaki Hashida, Seiji Shimizu
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Abstract
A processing method of forming a through-hole in a workpiece by means of a pulsed laser beam includes the steps of providing a removable sacrifice layer on the workpiece, forming a through-hole in the workpiece by the laser beam in a state where the sacrifice layer is provided, and removing the sacrifice layer from the workpiece after the step of forming the through-hole.
Claims9
A laser processing method for forming a through-hole in a workpiece by means of a pulsed laser beam, comprising the steps of:
- providing a removable sacrifice layer on said workpiece;
- forming a through-hole in said workpiece by the laser beam in a state where said sacrifice layer is provided;
- and
- removing said sacrifice layer from said workpiece after said step of making the through-hole, wherein
- an ablation threshold value of said sacrifice layer is not less than an ablation threshold value of said workpiece.
(canceled)
A product having a through-hole made by a pulsed laser, wherein
- (θ×d0.68)/φ≦4.0 is satisfied where φ (μm) denotes a diameter of said pulsed laser, θ (°) denotes a taper angle of said through-hole and d (μm) denotes a thickness of said product.
A product having a through-hole made by a pulsed laser, wherein
- said through-hole is straight-like in shape.
A product having a through-hole made by a pulsed laser, wherein
- a wall surface of said through-hole has no curved portion that is inwardly convex at one end of said through-hole such that a diameter of said through-hole expands as approaching an opening at said one end.
Dependencies are inferred from the claim text.