Package for semiconductor device and method of manufacturing the same

A package for a semiconductor device, comprising:

• a core substrate having two metal plates, each metal plate including a first through hole, a second through hole, a projection, and an insulating layer formed on its surface, the two metal plates being stacked in a manner that the projections of the mutual metal plates enter the second through hole of the metal plate on a partner side, and the first through holes of the metal plates form a through hole penetrating the core substrate;
• a conducting portion formed on the through hole penetrating the core substrate;
• and
• wiring patterns formed on both surfaces of the core substrate and electrically connected to each other through the conducting portion,
• wherein a tip end of each of the projections of the metal plates is exposed to a surface of the metal plate on the partner side to form a first terminal portion, and a second terminal portion is exposed from the insulating layer and formed on a surface of the metal plate on a side where the first terminal portion of the metal plate on the partner side is exposed.