Formation and integration of passive structures using silicon and package substrate
AssigneeBroadcom Corporation
InventorALI SARFARAZ
Life of this patent
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Abstract
An integrated circuit radio transceiver and method therefor includes an integrated circuit package that comprises a first substrate device, first and second nodes of a circuit on an outer surface of the first substrate device, a second substrate device and a trace on the second substrate device to provide crossover coupling. First and second bumps coupling the trace on the second substrate device to the first and second nodes on the first substrate device operable to provide crossover coupling.
Claims23
An integrated circuit package, comprising:
- first substrate device;
- a first circuit path comprising first and second traces on an outer surface of the first substrate device operably defining first and second electrical connection points on the first substrate device;
- second substrate device;
- and
- a second circuit path comprising a third trace formed on the second substrate device operably defining third and fourth electrical connection points on the second substrate device;
- and
- first and second bumps coupling the third and fourth connection points of the third trace on the second substrate device to the first and second connection points of the first and second traces on the first substrate device to form a hybrid passive structure to provide crossover coupling.
An integrated circuit package, comprising:
- first substrate device;
- first and second nodes of a circuit on an outer surface of the first substrate device;
- second substrate device;
- a trace on the second substrate device;
- and
- first and second bumps coupling the trace on the second substrate device to the first and second nodes on the first substrate device operable to provide crossover coupling.
A method for conducting a signal from a first node of a circuit on a die to a second node of the circuit on the die, comprising:
- producing the signal into the first node;
- conducting the signal through a first bump to a first trace formed on a separate substrate;
- conducting the signal through a second bump from the first trace formed on the separate substrate to the second node on the die;
- and
- conducting the signal from the second node on the die to a downstream electrical device.
Dependencies are inferred from the claim text.