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AssigneeNEC Electronics Corporation
InventorShinji Mitsuzono
Estimating the term…
A plurality of mounting terminals, a plane electrode formed around the plurality of mounting terminals, and a plurality of interconnects for plating, each of which is respectively connected to the plane electrode and a plurality of the mounting terminals different from each other are formed at one surface of the wiring board. The method of manufacturing the wiring board includes forming a mask film for plating on the insulating base, and forming a plated film on the mounting terminals and the interconnects for plating exposed out from the mask film; disposing, on the mask film for plating, a mask for removing interconnect so as to cover the plurality of openings for mounting terminals out of the regions having the plated film formed therein; and removing, through the mask for removing interconnect, the plated film and the interconnects for plating exposed out from the mask for removing interconnect.
A method of manufacturing a wiring board which includes,
A wiring board comprising:
A wiring board comprising:
A semiconductor device comprising:
Dependencies are inferred from the claim text.