Metal-ceramic composite substrate and method of its manufacture
OwnerYoshikazu Oshikainventor
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Abstract
A metal-ceramic composite substrate having excellent heat dissipation and a method of manufacturing such a metal-ceramic composite substrate at low cost are disclosed. A metal-ceramic composite substrate (10) comprises a metal substrate (11), a ceramic layer (12) formed on the metal substrate (11), an electrode layer (13) formed on the ceramic layer (12) and a solder layer (14) formed on the electrode layer (13) wherein the ceramic layer (12) is in the form of a thin film of a ceramic. Forming the ceramic layer (12) in the form of a thin film of aluminum nitride provides a metal-ceramic composite substrate (10) of excellent heat dissipating property for an electronic circuit.
Claims11
A metal-ceramic composite substrate comprising a metal substrate, a ceramic layer formed on the metal substrate, an electrode layer formed on the ceramic layer and a solder layer formed on the electrode layer, characterized in that said ceramic layer is in the form of a thin film of a ceramic.
A method of manufacturing a metal-ceramic composite substrate comprising a metal substrate, a ceramic layer formed on the metal substrate, an electrode layer formed on the ceramic layer and a solder layer formed on the electrode layer, characterized in that it comprises the steps of:
- forming a thin film of a ceramic as said ceramic layer on said metal substrate;
- and
- forming a selected pattern of said electrode layer on said ceramic layer.
Dependencies are inferred from the claim text.