Gap free anchored conductor and dielectric structure and method for fabrication thereof
AssigneesInternational Business Machines Corporation, Advanced Micro Devices, Inc. (Amd)
InventorsTibor Bolom, Stephan Grunow, David L. Rath, Andrew Herbert Simon
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Abstract
A microelectronic structure and a method for fabricating the microelectronic structure use a dielectric layer that is located and formed upon a first conductor layer. An aperture is located through the dielectric layer. The aperture penetrates vertically into the first conductor layer and extends laterally within the first conductor layer beneath the dielectric layer while not reaching the dielectric layer, to form an extended and winged aperture. A contiguous via and interconnect may be formed anchored into the extended and winged aperture while using a plating method, absent voids
Claims1
A microelectronic structure comprising:
- a first conductor layer located over a substrate;
- a dielectric layer located over the first conductor layer, the dielectric layer including an aperture located through the dielectric layer that exposes the first conductor layer, the aperture penetrating vertically into the first conductor layer and providing a sidewall discontinuity within the first conductor layer, and also extending laterally within the first conductor layer beneath the dielectric layer but not exposing an underside of the dielectric layer;
- and
- a second conductor layer located within the aperture, absent a void at an interface of the first conductor layer and the second conductor layer or an interface of the first conductor layer and the dielectric layer.
Dependencies are inferred from the claim text.