Cold weld hermetic mems package and method of manufacture
AssigneeStellar MicroDevices, Inc.
InventorCurtis Nathan Potter
Life of this patent
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Abstract
A cold welded hermetic micro or nano package sealed in an inert atmosphere with optional force maintenance means for ensuring permanent closure. A package cap 410 coated with precursor weld material is sealed to a package base 405 containing integral device 445 then cold welded with an external force mechanism to compress and flow cold seal preform material 435 creating a hermetic peripheral seal in an inert or vacuum atmosphere. Arrays of devices can be sealed with individual caps or arrays of caps which are interconnected.
Claims17
A method for hermetically sealing a micro- or nano-device comprising the steps:
- layering a base metallization precursor material on a package base;
- layering a cap metallization precursor material on a package cap which matches the position and shape of said precursor material on said package base;
- aligning said package cap with said package base inside a sealing chamber environment of rarified gas or vacuum such that said metallization precursor material of said package cap and said metallization precursor material of said package base enable a high degree of deformation and material flow during compression;
- applying pressure to said package cap and said package base with a bonding head;
- compressing a cold-weld preform gasket between said metallization precursor material of said package cap and metallization precursor material of said package base;
- and
- producing a cold-weld hermetic seal between said package cap and said package base.
A hermetically sealed micro- or nano-device comprising:
- a package cap upon which a metallization precursor material is layered;
- a package base upon which a metallization precursor material is layered and aligned with said package cap inside a sealed chamber environment;
- and
- a cold weld preform gasket compressed between said metallization precursor material of said package cap and said metallization precursor material of said package base hermetically sealing said package cap and said package base.
Dependencies are inferred from the claim text.