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US 2009/0151923 A1Published application
Thermal ground planes, thermal ground plane structures, and methods of heat management
AssigneeGeorgia Tech Research Corporation
InventorAndrei G. Fedorov
Life of this patent
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Abstract
Thermal ground planes, thermal ground plane structures, and methods of thermal energy management, are disclosed.
Claims24
A thermal ground plane structure, comprising:
- a phase separation structure having a vapor-filled area and a liquid-filled area, wherein the vapor-filled area and the liquid-filled area are separated by a semi-permeable structure, wherein the semi-permeable structure permits a vapor to be communicated from the vapor-filled area to the liquid-filled area and substantially prevents a liquid from being communicated from the liquid-filled area to the vapor-filled area;
- a porous high thermal conductivity structure disposed in a portion of the phase separation structure, wherein one side of the porous high thermal conductivity structure is adjacent to a thermal energy source, is in fluidic communication with a vapor-filled area of the phase separation structure, and extends into a portion of the liquid-filled area of the phase separation structure, wherein the porous high thermal conductivity structure passes through an opening in the semi-permeable structure so that the semi-permeable structure is adjacent one or more sides of the porous high thermal conductivity structure, wherein the porous high thermal conductivity structure absorbs liquid through capillary action so that liquid from the liquid-filled area is communicated into a portion of the porous high thermal conductivity structure that extends into the vapor-filled area;
- and
- a heat dissipater structure disposed on an external area of the liquid-filled area of the phase separation structure;
- wherein the porous high thermal conductivity structure is adjacent a thermal energy source so that thermal energy from the thermal energy source is transferred to the porous high thermal conductivity structure, wherein the porous high thermal conductivity structure absorbs the thermal energy, wherein the porous high thermal conductivity structure transfers the thermal energy to the liquid in the porous high thermal conductivity structure to form a vapor, wherein the vapor is communicated out of the porous high thermal conductivity structure into the vapor-filled area, wherein the vapor is communicated through the semi-permeable structure into the liquid-filled area, wherein the vapor condenses into the liquid, wherein thermal energy from the condensation process is transferred to the heat dissipater structure disposed on an external surface of the phase separation structure.
2 more elements
A method of removing and spreading thermal energy in a thermal ground plane, comprising:
- providing a thermal ground plane structure that includes:
- a phase separation structure having a vapor-filled area and a liquid-filled area, wherein the vapor-filled area and the liquid-filled area are separated by a semi-permeable structure, wherein the semi-permeable structure permits a coolant vapor to be communicated from the vapor-filled area to the liquid-filled area and does not permit liquid to be communicated from the liquid-filled area to the vapor-filled area;
- a porous high thermal conductivity structure disposed in a portion of the phase separation structure, wherein one side of the porous high thermal conductivity structure is adjacent to a thermal energy source, is in fluidic communication with a vapor-filled area of the phase separation structure, and extends into a portion of the liquid-filled area of the phase separation structure, wherein the porous high thermal conductivity structure passes through an opening in the semi-permeable structure so that the porous high thermal conductivity structure is disposed in both the vapor-filled area and the liquid-filled area of the phase separation structure, wherein the opening of the semi-permeable structure is adjacent one or more sides of the porous high thermal conductivity structure, wherein the porous high thermal conductivity structure absorbs liquid through capillary action so that liquid from the liquid-filled area is communicated into a portion of the porous high thermal conductivity structure that extends into the vapor-filled area and in contact with the thermal energy source;
- a heat dissipater structure disposed on an external surface of the liquid-filled area of the phase separation structure not within the liquid-filled area;
- a liquid disposed in the thermal ground plane structure;
- and
- a thermal energy source disposed adjacent the porous high thermal conductivity structure thermal energy;
- generating thermal energy from the thermal energy source;
- communicating the thermal energy from the thermal energy source to the porous high thermal conductivity structure, which absorbs the thermal energy;
- communicating the thermal energy absorbed by the porous high thermal conductivity structure to the liquid in the porous high thermal conductivity structure, wherein the liquid absorbs the thermal energy;
- generating vapor from the liquid upon the liquid absorbing the thermal energy from the porous high thermal conductivity structure, wherein the vapor flows out of the porous high thermal conductivity structure into the vapor-filled area;
- communicating the vapor through the semi-permeable structure into the liquid-filled area;
- condensing the vapor into a liquid in the liquid-filled area;
- and
- communicating the thermal energy from the condensation process to the heat dissipater structure disposed on an external surface of the phase separation structure.
12 more elements
A thermal ground plane structure, comprising:
- a phase separation structure having a vapor-filled area and a liquid-filled area, wherein the vapor-filled area and the liquid-filled area are separated by a semi-permeable structure, wherein the semi-permeable structure permits a vapor to be communicated from the vapor-filled area to the liquid-filled area and substantially prevents a liquid from being communicated from the liquid-filled area to the vapor-filled area;
- and
- a porous high thermal conductivity structure disposed in a portion of the phase separation structure, wherein one side of the porous high thermal conductivity structure is adjacent to a thermal energy source, is in fluidic communication with a vapor-filled area of the phase separation structure, and extends into a portion of the liquid-filled area of the phase separation structure, wherein the porous high thermal conductivity structure passes through an opening in the semi-permeable structure so that the semi-permeable structure is adjacent one or more sides of the porous high thermal conductivity structure.
A method of removing and spreading thermal energy in a thermal ground plane, comprising:
- providing a thermal ground plane structure that includes:
- a phase separation structure having a vapor-filled area and a liquid-filled area, wherein the vapor-filled area and the liquid-filled area are separated by a semi-permeable structure, wherein the semi-permeable structure permits a coolant vapor to be communicated from the vapor-filled area to the liquid-filled area and does not permit liquid to be communicated from the liquid-filled area to the vapor-filled area;
- a porous high thermal conductivity structure disposed in a portion of the phase separation structure, wherein one side of the porous high thermal conductivity structure is adjacent to a thermal energy source, is in fluidic communication with a vapor-filled area of the phase separation structure, and extends into a portion of the liquid-filled area of the phase separation structure, wherein the porous high thermal conductivity structure passes through an opening in the semi-permeable structure so that the porous high thermal conductivity structure is disposed in both the vapor-filled area and the liquid-filled area of the phase separation structure, wherein the opening of the semi-permeable structure is adjacent one or more sides of the porous high thermal conductivity structure;
- a heat dissipater structure disposed on an external surface of the liquid-filled area of the phase separation structure not within the liquid-filled area;
- a liquid disposed in the thermal ground plane structure;
- and
- a thermal energy source disposed adjacent the porous high thermal conductivity structure thermal energy;
- generating thermal energy from the thermal energy source;
- communicating the thermal energy from the thermal energy source to the porous high thermal conductivity structure, which absorbs the thermal energy;
- communicating the thermal energy absorbed by the porous high thermal conductivity structure to the liquid in the porous high thermal conductivity structure, wherein the liquid absorbs the thermal energy;
- generating vapor from the liquid upon the liquid absorbing the thermal energy from the porous high thermal conductivity structure, wherein the vapor flows out of the porous high thermal conductivity structure into the vapor-filled area;
- communicating the vapor through the semi-permeable structure into the liquid-filled area;
- condensing the vapor into a liquid in the liquid-filled area;
- and
- communicating the thermal energy from the condensation process to the heat dissipater structure disposed on an external surface of the phase separation structure.
12 more elements
Dependencies are inferred from the claim text.