Heat sink
AssigneesFu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
InventorsCHI-YUAN LAI, ZHI-YONG ZHOU, CHENG-TIEN LAI
Life of this patent
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Abstract
A heat sink adapter for cooling an electronic component includes a lower plate, an upper plate, an upper fin set and a lower fin set respectively fixed on the upper plate and the lower plate, and a plurality of heat pipes sandwiched between the upper plate and the lower plate. The lower plate includes a panel contacting the heat pipes, two sidewalls extending upwardly from the panel and separated from the heat pipes, and two flanges extending oppositely from the two sidewalls and soldered on the upper plate. The heat pipes are juxtaposed with each other at a central position thereof, and partially spaced from each other at two opposite end positions thereof.
Claims20
A heat sink adapted for cooling an electronic component, comprising:
- a lower plate;
- a lower fin set attached on a bottom face of the lower plate;
- an upper plate;
- an upper fin set attached on a top face of the upper plate;
- and
- a plurality of heat pipes sandwiched between the lower plate and the upper plate.
A heat sink for dissipating heat from an electronic component, comprising:
- a lower plate comprising a planar panel;
- a planar upper plate;
- and
- a plurality of heat pipes substantially sandwiched between the panel and the upper plate;
- wherein the heat pipes are straight and juxtaposed with each other and directly contact with each other at a first position, and are at least partially separated from each other at a second position and a third position, the first position is located between the second position and the third position.
Dependencies are inferred from the claim text.