Heat dissipation device
AssigneesFu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
InventorsWU LI, YI-QIANG WU
Life of this patent
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Abstract
A heat dissipation device includes a base, a fin group mounted on a top surface of the base, and a plurality of fasteners secured on the base. Each fastener includes a bolt extending through the base, and an elastic sleeve engaging with the bolt under the base. The sleeve defines a hole and the hole has a configuration such that the sleeve securely clasp the bolt. The bolt extends through the base and engages in the hole of the sleeve.
Claims14
A heat dissipation device adapted for dissipating heat generated by an electronic component mounted on a printed circuit board comprising:
- a base;
- a fin group mounted on a top surface of the base;
- and
- a plurality of fasteners secured on the base, each fastener comprising a bolt extending through the base and an elastic sleeve engaging with the bolt under the base;
- wherein the sleeve defines a hole and the hole has a configuration such that the sleeve securely clasp the bolt, and the bolt extends through the base and engages in the hole of the sleeve.
Dependencies are inferred from the claim text.