Heat dissipation device
AssigneesFu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
InventorPeng Liu
Life of this patent
Estimating the term…
Abstract
A heat dissipation device for removing heat from a heat generating-component mounted on a printed circuit board includes a heat sink and two heat pipes. The heat sink comprises a base plate in contact with the heat-generating component, two conducting arms extending upwardly and obliquely from two opposite ends of the base plate, a plurality of first fins extending upwardly from top surfaces of the base plate and the two conducting arms, and a plurality of second fins extending downwardly from bottoms surfaces of the conducting arms. The two heat pipes each comprise an evaporating section received in the base plate, at least a condensing section received in one of the conducting arms and at least a connecting section connecting at least an end of the evaporating section and the at least a condensing section.
Claims20
A heat dissipation device adapted for removing heat from a heat generating-component mounted on a printed circuit board comprising:
- a first heat sink comprising a first plate having a first horizontal part in contact with the heat generating-component and two oblique parts integrally extending obliquely from two opposite ends of the first horizontal part, a plurality of first fins extending downwardly from bottom surfaces of the two oblique parts;
- a second heat sink in complementary with the first heat sink, comprising a second plate having a second horizontal part and two oblique parts integrally extending obliquely from two opposite ends of the first horizontal part, a plurality of second fins extending upwardly from top surfaces of the second plate;
- two heat pipes each comprising an evaporating section, two condensing sections, two connecting sections connecting two opposite ends of the evaporating section with the two condensing sections;
- wherein the two evaporating sections of two heat pipes are sandwiched between two horizontal parts of the first and second plates, the condensing sections of one of the two heat pipes are sandwiched between the corresponding oblique parts of the first and second plates and the two connecting sections are located beyond the first and second heat sinks.
A heat dissipation device for removing heat from a heat generating-component mounted on a printed circuit board comprising:
- a heat sink comprising a base plate in contact with the heat-generating component, two conducting arms extending upwardly and obliquely from two opposite ends of the base plate, a plurality of first fins extending upwardly from top surfaces of the base plate and the two conducting arms, and a plurality of second fins extending downwardly from bottoms surfaces of the conducting arms;
- and
- two heat pipes each comprising an evaporating section received in the base plate, at least a condensing section received in one of the conducting arms and at least a connecting section connecting at least an end of the evaporating section and the at least a condensing section.
A heat dissipation device comprising:
- a first heat sink having a first base plate and a pair of first wings slantwise extending outwardly and upwardly from two opposite free ends of the first base plate, a plurality of first fins extending vertically and downwardly from a bottom surface of each first wing;
- a second heat sink having a second base plate parallel and corresponding to the first base plate of the first heat sink and a pair of second wings slantwise extending outwardly and upwardly from two opposite free ends of the second base plate, a plurality of second fins extending vertically and upwardly from top surfaces of the second base plate and the second wings;
- and
- first and second heat pipes sandwiched between the first and second heat sinks, the first and second heat pipes each having an evaporating section sandwiched between the first and second base plates, and a condensing section interconnecting the evaporating section via a connecting section;
- wherein the condensing sections of the first and second heat pipes are embedded in the first and second wings, the connecting sections of the first and second heat pipes are exposed out of the first and second wings.
Dependencies are inferred from the claim text.