Sheet cutting table
AssigneeLintec Corporation
InventorsHideaki Nonaka, Kenji Kobayashi, Yoshiaki Sugishita
Life of this patent
Estimating the term…
Abstract
A sheet cutting table 13, after sticking an adhesive sheet S to a semiconductor wafer W, for cutting the area outside the semiconductor wafer W as an unnecessary adhesive sheet S1 with a cutting device 15. The table 13 includes an inner table 52 which supports the semiconductor wafer W, and an outer table 51 corresponding to the unnecessary adhesive sheet S1 outside the semiconductor wafer W. The upper surface of the outer table 51 is provided with a non-adherable treatment surface 51A, and an adherable member formed with a ring member 53 or a plate member 63 for sticking the adhesive sheet S thereto.
Claims6
A sheet cutting table, after sticking an adhesive sheet having a larger plane area than that of a plate-like object to said plate-like object, for cutting the area outside said plate-like object as an unnecessary adhesive sheet, comprising:
- an inner table which forms a surface to place said plate-like object thereon;
- and an outer table, which is located outside said inner table, corresponding to said unnecessary adhesive sheet area;
- wherein
- the upper surface of said outer table is formed as a non-adherable treatment surface, and a part of the area is provided with an adherable member which is capable of sticking said unnecessary adhesive sheet area thereto.
Dependencies are inferred from the claim text.