Method for bonding components of medical devices
AssigneeMED Institute, Inc.
InventorsSteven J. Charlebois, W. Kurt Dierking
Life of this patent
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Abstract
A method of bonding a first component of a medical device to a second component of the medical device, where at least one of the components comprises a shape memory material, includes positioning the components in close proximity to each other to obtain an assembled configuration, and heating the assembled configuration at a temperature in the range of from about 800° C. to about 1100° C. to obtain a diffusion bond at a region of contact between the two components. The assembled configuration is formed into a desired set shape and heat-set at a temperature in the range of from about 350° C. to about 550° C. to impart a memory of the desired set shape to the shape memory materials without substantially impairing the diffusion bond.
Claims20
A method of bonding one component of a medical device to another component of the medical device, the method comprising:
- positioning a first component in close proximity to a second component to form an assembled configuration, at least one of the first and second components comprising a shape memory material;
- heat treating the assembled configuration at a temperature in the range of from about 800° C. to about 1100° C. to form a diffusion bond between the first component and the second component at a region of contact between the components;
- forming the assembled configuration into a desired set shape;
- and
- heat setting the assembled configuration at a temperature in the range of from about 350° C. to about 550° C. to impart a memory of the desired set shape to the shape memory material without substantially impairing the diffusion bond between the components.
A method of bonding an anchoring element to a portion of a stent, the method comprising:
- positioning an anchoring element in close proximity to a portion of a stent to form an assembled configuration, wherein at least one of the anchoring element and the portion comprises a shape memory material;
- heat treating the assembled configuration at a temperature in the range of from about 800° C. to about 1100° C. to obtain a bond between the anchoring element and the portion at a region of contact therebetween;
- forming the assembled configuration into a desired set shape;
- and
- heat setting the assembled configuration at a temperature in the range of from about 350° C. to about 550° C. to impart a memory of the desired set shape to the shape memory material without substantially impairing the bond between the anchoring element and the portion of the stent.
A method of bonding ends of a wire to form a medical device, the method comprising:
- positioning a first end of a wire in close proximity to a second end of the wire to form an assembled configuration, wherein the wire comprises a shape memory material;
- heat treating the assembled configuration at a temperature in the range of from about 800° C. to about 1100° C. to obtain a bond between the first end and the second end at a region of contact therebetween;
- forming the assembled configuration into a desired set shape;
- and
- heat setting the assembled configuration at a temperature in the range of from about 350° C. to about 550° C. to impart a memory of the desired set shape to the shape memory material without substantially impairing the bond between the first end and the second end of the wire.
Dependencies are inferred from the claim text.