Gap mapping for fitting composite doublers

Apparatus for measuring gaps between two surfaces over a two dimensional area, comprising:

• first and second layers of dielectric material;
• a two dimensional array of capacitive sensing devices between the first and second layers, each of the capacitive devices measuring the gap thickness in the area surrounding the sensing device;
• and
• a processor for processing the gap thickness measurements.

A method of mapping gap thicknesses between a first conductive surface and a second non-conductive surface, comprising the steps of:

• placing a first layer of dielectric material against the first conductive surface;
• placing a second layer of conductive material against the second non-conductive surface;
• interposing an array of capacitive sensing devices between the first and second layers;
• sensing the thickness of the gap between the first and second surfaces at each of a plurality of locations using the capacitive sensing devices;
• and,
• collecting signals from the capacitive devices representing the measured gap thicknesses.

A method of fabricating a composite doubler for application to the surface of a structure:

• forming the composite doubler;
• placing an array of capacitive gap thickness sensors between the doubler and the structure surface;
• measuring the gap thickness between the doubler and the structure surface in a plurality of areas over the surface of the structure;
• using the gap thickness measurements to shape a layer of adhesive to essentially match the contour of the structure surface;
• and,
• applying the layer of adhesive to the doubler.

A method of bonding a composite doubler on an uneven, structural surface, comprising the steps of:

• placing a gap-measuring blanket on the structural surface;
• placing the doubler on the blanket;
• measuring the gap between the structural surface and the doubler at a plurality of locations using the blanket;
• using the gap measurements to generating a data file representing a map of the gap thicknesses between the doubler and the structural surface;
• shaping a surface of an adhesive layer using the generated data file;
• placing the shaped adhesive layer between the doubler and the structural surface, such that the shaped surface of the adhesive fills the gaps between the doubler and the conductive surface.

Apparatus for measuring and mapping gaps between a first conductive surface and a second non-conductive surface, comprising:

• a first layer of dielectric material adapted to be placed against the first conductive surface;
• a second layer of dielectric material;
• a third layer of electrically conductive material sandwiched between the second non-conductive surface and the second layer;
• a plurality of capacitive devices sandwiched between the first and second layers, each of the capacitive devices producing signals representing a measurement of the gap between the first and second surfaces in the area of the coil;
• and,
• a processor coupled with the capacitive devices for mapping the gaps.

A method of fabricating a composite doubler for application to a surface of a structure:

• forming the composite doubler;
• placing an array of capacitive gap thickness sensors between the doubler and the structure surface;
• measuring the gap thickness between the doubler and the structure surface in a plurality of areas over the structure surface;
• using the gap thickness measurements to shape a layer of adhesive to essentially match the contour of the structure surface;
• and,
• applying the layer of adhesive to the doubler.