Electron-emitting device manufacturing apparatus, solution including metal micro-particles, electron-emitting device, and image displaying apparatus

An electronic circuit board manufacturing apparatus for forming dot patterns between electrodes on a substrate, said electronic circuit board manufacturing apparatus comprising:

• a discharge head of a piezo-jet type using a piezoelectric element, said discharge head having discharge opening and jetting a solution that includes metal micro-particle material for forming the conductive thin film, and said discharge head jetting the solution on the electrodes and on the area between the electrodes at a speed between 6 m/s and 18 m/s and in a range from a few picoliter to a few tens of picoliters and vaporizing a volatile component in a solution dot pattern after the droplet is jetted on the substrate so that a solid content remaining on the substrate as its thickness is in a range form a few Å to 1 μm,
• wherein the solution having metal micro-particle dispersed in liquid satisfies a relationship of 0.0002≦Dp/Do≦0.01, where Dp denotes a diameter of the metal micro-particle and Do denotes a diameter of the discharge opening.

An electronic circuit board manufacturing apparatus for forming dot patterns between electrodes on a substrate, said electronic circuit board manufacturing apparatus comprising:

• a discharge head of a thermal-jet type using a heating element, said discharge head having a discharge opening and jetting a solution that includes the metal micro-particle material for forming the conductive thin film, and said discharge head jetting the solution on the electrodes and on the area between the electrodes at a speed between 6 m/s and 18 m/s and in a range from a few picoliter to a few tens of picoliters and vaporizing a volatile component in a solution dot pattern after the droplet is jetted on the substrate so that a solid content remaining on the substrate as its thickness is in a range from a few Å to 1 μm,
• wherein the solution having metal micro-particle dispersed in liquid satisfies a relationship of 0.0002≦Dp/Do≦0.01, where Dp denotes a diameter of the metal micro-particle and Do denotes a diameter of the discharge opening.

An electronic circuit board comprising:

• a substrate;
• and electrodes and a plurality of dot patterns that connect said electrodes electrically, said dot patterns are formed by jetting solution including a metal micro-particle material on the area between the electrodes, and vaporizing a volatile component in solution dot patterns after the droplets of solution are jetted on the substrate so that a solid content remaining on the substrate,
• wherein a diameter of the metal micro-particle in the solution is equal to or less than a roughness of a surface of the substrate where dot patterns are formed, and a thickness of the dot patterns are greater than the roughness of the surface of the substrate.

An electronic circuit board comprising:

• a substrate;
• and electrodes and a plurality of dot patterns that connect said electrodes electrically, said dot patterns are formed by jetting solution including a metal micro-particle material on the area of said electrodes and between the electrodes, and vaporizing a volatile component in solution dot patterns after the droplets of solution are jetted on the substrate so that a solid content remaining on the substrate,
• wherein a length between the electrodes is in a range from 1 μm to 100 μm, a width of the electrodes is in a range from a few μm to a few hundred μm and a thickness of the electrodes is in a range from 100 Å to 1 μm, wherein said dot pattern thickness is in a range from a few Å to 1 μm formed by jetting the quantity of the solution from a few picoliter to a few tens of picoliters per dot pattern.