System for uniform structuring of substrates

Abstract

The invention relates to a system for transferring a nanostructure from a die to a flat side of a large-area substrate with a substrate holder that receives the substrate on a substrate receiving surface, and an actuator device that can be oriented parallel to the substrate receiving surface and opposite to this movable structural surface of the die and that acts orthogonally to the substrate receiving surface. To be able to use reasonably priced dies and in this case to achieve the highest possible throughput, a good edge yield, and a homogeneous structure with the substrate as much as possible without scrapping, a system is proposed with which the resultant force that acts through the die on the substrate surface can be shifted along the die surface.

Dependencies are inferred from the claim text.