Manufacturing method for a card and card obtained by said method

A method for manufacturing a dual interface card comprising a dual interface module showing free contact electrodes at the surface of the card for contact-type communication, and pads connected to an antenna embedded in the card body for contactless-type communication, the method comprising:

• collocating multiple card support sheets one onto the other, some of the sheets showing holes to form a recess adapted to receive the dual interface module, one of the sheets supporting the antenna having solid metallic contact pads at least partially freely accessible in the recess;
• depositing a conductive adhesive onto the contact pads;
• positioning the dual interface module in the recess such that the pads of the module are contacting the conductive adhesive;
• and
• executing a lamination step of the sheets with the module in order to:
• laminate the multiple layers together into the card body;
• embed the dual interface module in the recess;
• and
• achieve a curing of the conductive adhesive, and the electrical contact between the antenna and the dual interface module.