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US 2009/0144970 A1Published application
Fabricating an array of mems parts on a substrate
AssigneeWinMEMS Technologies Holdings Co., Ltd.
InventorsTseng-Yang Hsu, Chih-Hsiang Lai
Life of this patent
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Abstract
A method for fabricating a micro-electro-mechanical system (MEMS) device. The method comprises fabricating a MEMS part on a substrate, and detaching the MEMS part from the substrate. After detaching the MEMS part from the substrate, attaching the MEMS part to an application platform.
Claims20
A method comprising:
- fabricating a micro-electro-mechanical system (MEMS) part on a substrate, the MEMS part being connected to a structure on the substrate at an anchor point;
- detaching the MEMS part from the structure at or near the anchor point with force to remove the MEMS part from the substrate;
- and
- after removing the MEMS part from the substrate, attaching the MEMS part to an application platform.
1 more element
A method comprising:
- forming a sacrificial layer on a substrate;
- forming an island connecting to a micro-electro-mechanical system (MEMS) part on the sacrificial layer;
- removing the sacrificial layer except a portion of the sacrificial layer located between the island and the substrate;
- detaching the MEMS part from the substrate;
- and
- after detaching the MEMS part from the substrate, attaching the MEMS part to an application platform.
3 more elements
An apparatus comprising:
- an application platform;
- and
- a micro-electro-mechanical system (MEMS) part on the application platform, the MEMS part having a broken surface formed by detaching the MEMS part with force from a substrate on which the MEMS part was fabricated, and a bonding surface to attach to the application platform.
Dependencies are inferred from the claim text.