Single-Layer Metallization and Via-Less Metamaterial Structures

A metamaterial device, comprising:

• a dielectric substrate having a first surface and a second, different surface;
• a first metallization layer formed on the first surface;
• and
• a second metallization layer formed on the second surface,
• wherein the first and second metallization layers are patterned to have two or more conductive parts to form a composite left and right handed (CRLH) metamaterial structure that comprises a unit cell which is free of a conductive via penetrating the dielectric substrate to connect the first metallization layer and the second metallization layer.

A metamaterial device comprising:

• a dielectric substrate having a first surface and a second, different surface;
• a cell patch on the first surface;
• a top ground electrode spaced from the cell patch and located on the first surface;
• a top via line on the first surface having a first end connected to the cell patch and a second end connected to the top ground electrode;
• a cell launch pad formed on the second surface beneath the cell patch on the first surface and electromagnetically coupled to the cell patch through the substrate to direct a signal to or receive a signal from the cell patch without being directly connected to the cell patch through a conductive via that penetrates through the substrate;
• and
• a bottom feed line formed on the second surface and connected to the cell launch pad to direct the signal to or from cell launch pad,
• wherein the cell patch, the top ground electrode, the top via line, the cell launch pad, and the bottom feed line form a composite left and right handed (CRLH) metamaterial structure.